PCB Manufacturing with Consistent Quality and Flexible Supply

All design files (.gerber, .pcb, .pcbdoc, .cam) undergo a comprehensive DRC check, including trace width/spacing, layer alignment, and stackup compatibility.
Our engineers provide direct feedback to resolve manufacturability issues before production.

Stackup is defined based on layer count, impedance, and copper weight.
Materials include FR4, High-TG, halogen-free, and Rogers laminates, all inspected for thickness and moisture control.

LDI exposure ensures high-precision circuit imaging.
Post-etching AOI detects opens, shorts, and critical defects on every inner layer.

Layers are bonded under controlled temperature (180–210°C) and pressure conditions.
Alignment tolerance is maintained within ±30 μm, ensuring dimensional stability and flatness for high-yield production.

Mechanical drilling achieves hole sizes down to 0.15 mm with ±30 μm accuracy.
Aspect ratio up to 10:1 ensures reliable plating in thick and heavy copper boards.

Plasma or chemical desmear removes resin residues and prepares hole walls for strong copper adhesion.

Electroplating deposits 20–35 μm copper in vias and holes, ensuring consistent electrical reliability and structural strength in volume production.

LDI defines outer circuits with precision down to 25 μm.
AOI verifies trace accuracy and detects opens, shorts, and critical defects.

Solder mask alignment is controlled within ±50 μm to protect pads and traces.
Legends are applied for durability and clarity.

Available finishes include HASL, Lead-Free HASL, ENIG, Immersion Tin, and OSP.
ENIG thickness is tightly controlled for high-reliability applications.

100% electrical testing (via dedicated test fixtures or flying probe), AOI, and cross-section analysis ensure full compliance with IPC Class 2/3 standards for industrial-grade reliability.