Product Display
Product Application: Automotive Braking System
Product Structure: 4-Layer Through-Hole Board
Product Thickness: 1.60mm
Trace Width/Space: 0.10mm / 0.13mm
Minimum Hole Size: 0.2mm （Via）
Surface Finish: ENIG
Process Feature: TG170
Product Application：EV OBC, DC/DC, PDU
Product Structure: 4-Layer Through-Hole Board
Product Thickness: 1.60mm
Trace Width/Space: 0.15mm / 0.15mm
Minimum Hole Size: 0.30mm （Via）
Surface Finish: Lead-Free HASL
Process Feature: TG150
Product Application: Automotive Lighting Board
Product Structure: 4-Layer Through-Hole Board
Product Thickness: 1.60mm
Trace Width/Space: 0.10mm / 0.10mm
Minimum Hole Size: 0.30mm （Via）
Surface Finish: ENIG
Process Feature: TG150
Product Application: Automotive BMS
Product Structure: 1-Layer Aluminum Substrate Board
Product Thickness: 2.00mm
Trace Width/Space: 0.20mm / 0.20mm
Minimum Hole Size: 2.00mm
Surface Finish: Lead-Free HASL
Process Feature: 2.0W/mK
Application: Robot Vacuum Module
Structure: 8L Through-hole Board
Thickness: 1.60mm
Trace Width/Spacing: 0.075/0.075mm
Min. Aperture: 0.2mm via
Surface Finish: ENIG
Process Features: TG150, Castellated Holes
Application: Robot Vacuum
Structure: 4L Through-hole Board
Thickness: 1.60mm
Trace Width/Spacing: 0.10/0.075mm
Min. Aperture: 0.20mm via
Surface Finish: ENIG
Process Features: TG150
Application: IoT Module
Structure: 4L Through-hole Board
Thickness: 1.00mm
Trace Width/Spacing: 0.075/0.075mm
Min. Aperture: 0.2mm via
Surface Finish: ENIG
Process Features: TG150, Castellated Holes (Half-holes)
Application: Charging Station
Structure: 4L Through-hole Board
Thickness: 2.00mm
Trace Width/Spacing: 0.20/0.20mm
Min. Aperture: 0.40mm
Surface Finish: Lead-free HASL
Process Features: TG150 2/2/2/2oz
Application: Security & Surveillance
Structure: 4L Through-hole Board
Thickness: 1.60mm
Trace Width/Spacing: 0.075/0.075mm
Min. Aperture: 0.2mm via
Surface Finish: OSP
Process Features: No Ghosting / Image Doubling Prohibited
Application: Speaker Mainboard
Structure: 6L Through-hole Board
Thickness: 1.60mm
Trace Width/Spacing: 0.075/0.05mm
Min. Aperture: 0.200mm via
Surface Finish: ENIG
Process Features: TG150
Application: Industrial Control Motherboard
Structure: 6L Through-hole Board
Thickness: 1.60mm
Trace Width/Spacing: 0.075/0.05mm
Min. Aperture: 0.20mm via
Surface Finish: OSP
Process Features: TG150
Application: Solar Inverter
Structure: 4L Through-hole Board
Thickness: 1.60mm
Trace Width/Spacing: 0.13/0.13mm
Min. Aperture: 0.30mm
Surface Finish: Lead-free HASL
Process Features: TG150
